Date: Thu, 19 Jun 2003 09:58:27 GMT
From: hohnopsamlid.invalid (Goran Larsson)
Subject: Re: SID

In article <D%7Ia.70215$>, Bill Jackson <> wrote: > It appears that the > flex from one board to the other is held on with either a reflow solder or > conductive glue/foam. It is conductive glue. > If anyone has a SID that has bad pixels in it and wants to contribute to a > "fix the SID" project, let me know directly. It has already been done. < > -- G–ran Larsson

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